SN74AVC8T245: VQFN package's LAND PATTERN DATA

Y.Ottey

Mastermind 6145 points

Part Number: SN74AVC8T245
Other Parts Discussed in Thread: SN74AXC8T245

Dear all,

Would you mind to ask about Land pattern of SN74AVC8T245?
Our customer would like to know about this.

According to Datasheet p.31, There is Via Layout Design in this page.

However they can not make via parts on the board.

Is it possible design this device (VFQN package) on no via parts or IHV(Interstitial Via Hole) parts in the board?

It would be great if you could let me know your thoughts on the following the question.

Best regards,

Yu Ohta

over 5 years ago

0 Emrys Maier over 5 years ago

TI__Guru* 96591 points

Hi Yu Ohta,
We'll get back to you when we return to work on Monday.

0 Y.Ottey over 5 years ago in reply to Emrys Maier

Mastermind 6145 points

Hi,Emrys

Our customer would like to konw answer early.
Please give me this answer as soon as possible.

Y.Ottey

0 Emrys Maier over 5 years ago in reply to Y.Ottey

TI__Guru* 96591 points

I have asked our translation expert to reply today.

0 ShreyasRao over 5 years ago

TI__Guru 56100 points

Hi Yu Ohta san,

The land pattern is an example or can be considered as a general guideline or recommendation from TI.
It is not necessary to follow them and can be modified according to the needs of the customer and the layout.
Since the logic/translator devices doesnt dissipate much power, the vias may not be necessary in the board.

Please refer to the app note on QFN packages here below which talks about the thermal pad vias:
www.ti.com/.../slua271b.pdf

0 ShreyasRao over 5 years ago in reply to ShreyasRao

TI__Guru 56100 points

Hi Yu Ohta san,

Based on the requirement, the customer can also consider using the SN74AXC8T245 in the RJW package.
This is even smaller than the RHL package which can save on space.
Please let me know.

Logic

Logic forum

SN74AVC8T245: VQFN package's LAND PATTERN DATA