Part Number: SN74LVC1G14
Hi,When comparing SCES218W datasheet and SCES218Y datasheet, the recommended land patterns are different.SN74LVC1G14DSFR.pdf1.Could you tell me the reason for the change2.Is there any problem if it matches the land pattern of the old data sheet?Regards,Yusuke
It was likely changed to update the formatting. If you look at it closely we are talking hundredths of a mm difference between the two images. This means its not likely that the old land pattern won't work.
If there is ever an uncertainty you can also make your own footprint using the device dimensions given.
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In reply to Dylan Hubbard:
Hi Dylan,Thank you for your response.Customers are worried about the curve shape.>It was likely changed to update the formatting.Could you tell me the details of the shape change?Customers need that information to relate to the reliability of the implementation.Regards,Yusuke
In reply to Tsukui Yusuke:
The shape of the pad won't change the electrical performance.
Hi Dylan,Thank you for your support.>The shape of the pad won't change the electrical performance.I understand.However, Customer is worried about joining strength of solder of device.Customers have been implementing based on old data sheets.Could you tell me the details of the shape change?Regards,Yusuke
Hi Dylan,Is there any update about joining strength of solder issue and change reason?Please contact me again once you have some updates.Regards,Yusuke
If they are using the old layout example and it is working, then they can continue to use that layout. That page is guideline not a requirement.
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