TI E2E Community

TI enables the Internet-of-Things with sub-1GHz 6LoWPAN solution

Firefighter — Thu, 20 Oct 2011 12:20:00 GMT

TI has just recently introduced new sub-1 GHz 6LoWPAN solutions, aimed at providing a gateway for remote, low-cost wireless sensors to connect to the Internet and a wireless extension of wired IPv6 infrastructures. By operating in the sub-1GHz band, TI’s 6LoWPAN solutions offer longer wireless range at lower power levels than traditional 2.4 GHz-based 6LoWPAN offerings. The 6LoWPAN solutions support large-scale mesh networks and are suitable for applications such as Smart Grid, security, home and building automation, street lighting and other wireless sensor networks. The new product family includes the CC1180 network processor, CC430 complete system-on-chip (SoC) microcontrollers, 6LoWPAN software stack, and CC-6LOWPAN-DK-868 development kit. For more information, visit www.ti.com/6lowpan.

As plug-and-play solutions, TI’s 6LoWPAN devices require little RF expertise and can be set up using standard IP socket programming to quickly add wireless and Internet connectivity to networks. Self-healing capabilities of TI’s solutions would also assist in efficient monitoring of the network – if a node went out, other nodes would find another way through the network to maintain the connectivity.

Key features and benefits: TI’s 6LoWPAN solutions

Features	Benefits
Scalable platform of cost-effective, low-power 6LoWPAN solutions	CC1180 wireless network processor Handles all timing-critical and processing-intensive 6LoWPAN protocol tasks Leaves resources of host microcontroller free to handle the application. Preloaded with TI third party Sensinode’s NanoBoot bootloader CC430 SoC microcontroller family Supports 6LoWPAN software library stack and application code running on the same silicon for smallest footprint solution
Built upon TI’s market-leading sub-1 GHz RF CC1101 technology, with range of more than 800 meters out of the box with development kit	Supports large-scale mesh networks Enables long range between nodes
Compact software solution with small code size	Easy-to-use, no need for extensive development Low-cost solution due to small memory / microcontroller requirements
Uses socket API	Plug-and-play solution drives faster development without the need for extensive RF knowledge Developers used to standard IP socket programming will be able to set up a 6LoWPAN network
Highly self-healing and self-maintaining mesh routing solution	If a node drops out, surrounding nodes will still find their way through the network and the connection will be maintained
System supports hundreds of hops	Enables development of wireless mesh networks with large network depth using only one gateway.
Operates in 315, 433, 868 and 915 MHz	Fully optimized for industrial, scientific and medical (ISM) frequency bands

Tools, availability, packaging and price

The CC1180 solution is available today from TI and through authorized TI distributors, and is packaged in a ROHS-compliant, 6 mm x 6 mm QFN-36. The CC430 solutions are available today from TI and through authorized TI distributors, and are packaged in ROHS-compliant, 7 mm x 7 mm QFN-48 (no LCD driver) and 9 mm x 9 mm QFN-64 (integrated LCD driver).

The CC-6LOWPAN-DK-868 development kit is available today for USD $899 on TI’s e-store. This kit supports 868 MHz frequency band and can quickly be reconfigured in software for operation in the 915 MHz ISM band. Additional evaluation module kits can be purchased separately to support other frequencies.

For a demonstration of a lighting application using TI 6LoWPAN technology you can have a look at this video from ESC Boston 2011: http://www.engineeringtv.com/video/LED-Lighting-Control-from-TI;ESC-Boston-2011-Videos

Get the PurePath Wireless Headset Development Kit: CC85XXDK-HEADSET

Warren Pereira — Thu, 09 Jun 2011 12:35:56 GMT

Are you looking to design a wireless headset? We might just have what you need!

Check out the new PurePath Wireless Headset Development Kit: CC85XXDK-HEADSET and order you kit now!

Development kit content:

2 x CC85XX Headset boards
2 x Battery (3.7V, 465mAh Li-ion)
1 x CC Debugger
1 x USB micro cable
1 x 3.5mm jack to 3.5mm jack cable

The development kit comes pre-programmed with firmware as described in the quick start user’s guide. This firmware is available as an example project in PurePath Wireless Configurator tool (PPWC) PC software. The functionality of the kit can be changed by using PPWC.

To get the kit for $99, use the coupon code: KS9U-BV3P (Valid Until June 30th)

The New CC8530 PurePath™ Wireless

Warren Pereira — Wed, 08 Jun 2011 14:50:00 GMT

The PurePath™ Wireless platform is a cost-effective and low-power solution optimized for wireless transmission of high-quality digital audio.

The CC85xx includes a robust built-in wireless audio transmission protocol and can control selected external audio devices. Utilizing numerous coexistence mechanisms allows the CC85xx to avoid interfering with, or being interfered by other 2.4 GHz radio systems.

The CC85xx operates autonomously, and can be used with or without an external MCU. An external host processor can be connected through SPI and control some aspects of its operation. The CC85xx interfaces easily with other TI audio ICs and DSPs (using I2S and DSP/TDM interfaces). More details can be found here.

Visit the Technical documents

Functional Diagram:

Alektrona and Wireless Glue pass Zigbee Smart Energy profile testing

Foe — Thu, 13 Jan 2011 20:25:31 GMT

Congratulations to Alektrona and Wireless Glue on achieveing Smart Energy certification with their products as members of the Zigbee Alliance.

Both Alektrona and Wireless Glue are part of the TI Low Power RF developer network. We are pleased that all their hard work has paid off. For those of you who are interested in joining our Third party developer program.

Check out the web sites:

Alektrona:

http://www.alektrona.com/products.html

Wireless Glue:

http://www.wirelessglue.com/solutions.htm

CC2530ZDK_ZNP_mini Call for Early Adopters .... Help us with your feedback

Mark Grazier — Fri, 17 Sep 2010 19:41:00 GMT

Hello CC2530 FANS!

We are looking for about 10-12 early adopters who have the time to look at the absolute earliest version of new ZigBee CC2530ZDK_ZNP_mini kit and collateral. Most important we need your time commitment to provide feedback for our successful launch.

We would like to get your candid comments on the " out of the box " user experience. We want to make this a great "user friendly" development platform.

If you are interested please let me know. Please take a moment to look at our preliminary preview of the kit in the powerpoint presentation listed below

Thanks for your interest . We have a very limited number of early kits so let me know ASAP !

CC2530ZDK_ZNP_mini kit recommended for new designs and replacing CC2480DK

Mark Grazier — Wed, 15 Sep 2010 15:30:00 GMT

We have placed some preliminary information on the TI website for the CC2530ZDK_ZNP_mini kit which is the recommended replacement for the CC2480DK kit.

The CC2480 is not recommended for new designs because the ZigBee PRO stack will not fit on the CC2480 since it only has 128k of flash. In addition, the ZigBee profiles going forward will only iuse the latest version of ZigBee PRO.

The CC2530ZDK_ZNP_mini should be available in late October and we will announce when these kits are in stock. Right now they are in our contract manufacturer for assembly and final testing.

Z-Stack PRO/2007 2.3.1

Dirty Harry — Thu, 09 Sep 2010 16:15:00 GMT

The TI protocol stack implementing the ZigBee PRO/2007 specification and the Smart Energy Feature Set is available for download now:

http://focus.ti.com/docs/toolsw/folders/print/z-stack.html

Note that the ZStack-CC2530 does support the CC2531 USB. Although the only sample application with an explicit CC2531 target build is the ZNP, two other sample apps that have an explicit CC2531 build target will be announced in this blog.

It is highly recommended to immediately migrate any existing Z-Stack application(s) to this 2.3.1 Z-Stack as it contains significant enhancements, bug fixes, and greatly increased robustness in very large network stress testing. Because no API's nor the the IAR compiler version were changed, the porting effort from Z-Stack 2.3.0 consists of nothing more than adding a new .c module to the IAR project as shown in the attached document. As always, this E2E community is the first place to come for questions and support on the Z-Stack 2.3.1 as well as all TI - LPRF products. Subscribe to this blog for important intra-release enhancements, additional sample applications, bug-fix patches, document updates and upcoming release announcements.

TI LPRF and Z-Stack - We make RF easy ... we connect the world.

Hello LPRF World: Check out our new CC430 Platform announced at Elektronika 2008

Glenn B — Thu, 13 Nov 2008 10:19:00 GMT

TI CC430 technology and product platform was announced at Electronica today.

http://www.embedded.com/products/integratedcircuits/212001671

http://www.ti.com/corp/docs/landing/cc430/index.htm?DCMP=CC430&HQS=Other+OT+cc430