What do i need to do to get it to work? Is it just setting up the Shared RAM arrays and using the C28 shared ram linker script? Do I need to do anything in the linker script to get with the DMA and the shared regions to be the same? Let me know, thanks.
It'll be great if you could provide some more details about the issue you are facing and the device name which you are working on.
If my reply answers your question please click on the green button "Verify Answer".
im using the f28m35h52c1. im reading an adc buffering with dma to shared ram. sending data to usb peripheralo
I'm on my cell phone and its hard to type but to be clear want to send the data in the shared ram out the usb with udma
By seting up the descriptor of uDAM channel, associated with USB, with proper source and destination address, you should be able to get this woking.
Ok, thanks. What about setting up the DMA to xfer from ADC to the shared memory of the two cores. Is that possible? What do i need to do? Again is it the right linker script?
Yes, you can setup uDMA to do data tranfer from ADC to Shared RAMs but you need software to trigger the start of transfer because ADC trigger events are not mapped on uDMA. You can use the SW channel of uDMA for this purpose.
I was trying to use DMA, not uDMA, to xfer data to the shared RAM, but nevertheless I figured it out. My next question is there a way to configure the linker script to have a multiple blocks of RAM map to a single buffer
All content and materials on this site are provided "as is". TI and its respective suppliers and providers of content make no representations about the suitability of these materials for any purpose and disclaim all warranties and conditions with regard to these materials, including but not limited to all implied warranties and conditions of merchantability, fitness for a particular purpose, title and non-infringement of any third party intellectual property right. TI and its respective suppliers and providers of content make no representations about the suitability of these materials for any purpose and disclaim all warranties and conditions with respect to these materials. No license, either express or implied, by estoppel or otherwise, is granted by TI. Use of the information on this site may require a license from a third party, or a license from TI.
TI is a global semiconductor design and manufacturing company. Innovate with 100,000+ analog ICs andembedded processors, along with software, tools and the industry’s largest sales/support staff.