This thread has been locked.
If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.
Dear MSP community,
The complexity of applications is increasing, and the integration of functions on a single chip is also increasing. Therefore it is natural that dedicated functions sometimes do not work as a developer expects.
In such cases, often a malfunction of the silicon is claimed with a very high-level description. In most cases it is revealed that the silicon itself did not necessarily cause the problem, but the problem was instead application related. Due to complexity, it is sometimes hard to determine the real cause of the malfunction. However there are multiple ways to identify a malfunction, saving time and effort for both the end customer and the vendor. This document provides some principle ways to determine the root cause of a certain number of high-level unintended behaviors. This document help to develop the troubleshooting abilities of a developer by better understanding the relation between application-related issues and siliconrelated specifications and functionalities. The process in this application report describe how silicon features and measurement techniques can be used to better understand and solve these issues.
Please read through the document below trying to get thing resolved more quickly!
Best regards,Dietmar Walther
We are glad that we were able to resolve this issue, and will now proceed to close this thread.
If you have further questions related to this thread, you may click "Ask a related question" below. The newly created question will be automatically linked to this question.
Please click "This resolved my issue" if your question gets answered! Cite me with @ so I notice your messages.
All content and materials on this site are provided "as is". TI and its respective suppliers and providers of content make no representations about the suitability of these materials for any purpose and disclaim all warranties and conditions with regard to these materials, including but not limited to all implied warranties and conditions of merchantability, fitness for a particular purpose, title and non-infringement of any third party intellectual property right. TI and its respective suppliers and providers of content make no representations about the suitability of these materials for any purpose and disclaim all warranties and conditions with respect to these materials. No license, either express or implied, by estoppel or otherwise, is granted by TI. Use of the information on this site may require a license from a third party, or a license from TI.
TI is a global semiconductor design and manufacturing company. Innovate with 100,000+ analog ICs andembedded processors, along with software, tools and the industry’s largest sales/support staff.