Dear all,
We want to use the MSP430F5328 in a new design using the BGA package. This BGA is a 80 ball with a spacing of 0,5mm.
For BGA with a spacing of 1,0mm or 0,8mm is it very common to use small via's in between the pads of the BGA to escape the routing to different layers (see picture).
The pattern of centering the through-via within the four adjacent BGA land pads cannot be used with 0,5 mm pitch BGA’s. This is due to the smallest through-via pad being too large to fit in the space available between the land pads. So my questions is: how do I route the inner BGA pads MSP430F5328 in 80-balls BGA?
Thanks in advance,
Antoine