Hi,
I'm looking to build a breakout board for the TMP006, to test the part for suitability in my target application. I have access to PCB production equipment, and would rather use this (at least during early prototyping) than have a set of boards manufactured and be subject to my supplier's 4-week turnaround on bare-PCB orders (or a significantly higher price to reduce the delivery time frame).
This, however imposes some restrictions - my minimum drill size for in-house prototype boards is 0.6mm, and the manufacturing equipment is limited to 6mil track width and 6mil spacing. I can produce double sided boards but WITHOUT through-plating or solder-masking.
Ideally I'd prefer to use a 0.8mm drill size, as this would allow me to use Harwin-type solid track pins (Harwin P/N T1559F46) to form the vias, however bare-wire and a 0.6mm drill is another option.
Now onto my questions:
How can I limit the effect this will have on the TMP006?
What effects can I expect from varying the PCB layout in this manner?
What is the best way to handle the increased amount of space required for the vias? Should I increase the area of the internal copper fill, extend the tracks out into the isolation area, or some combination of the two?
Alternatively, could the TMP006 be used if it were soldered into an IC socket with thin wire and operated suspended in air (instead of mounted on a PCB)?
Thanks,
Phil.