We are using in multiple design the TI’s temperature sensor LM96163CISD. This device has a central pad. There is not a single word in the datasheet of this device on how to connect this central pad.
In our previous design I’ve left this pad floating but from the EVB of TI I learn that this device’s central pad should be connected to GND. Is this indeed how the correct connectivity should be, the central pad should be connected to GND?( EVM user guide, page #29)
