Hi BU team
My customer Finisar shanghai site issued an application issue of TMP007 , where TMP007 was in a heat flow meter and monitor the temerature of optical module's shell. In Ctm's application, thermopile’s ambient temperature may vary from -45 to 80℃. In order to prevent the affection of ambient temperature which could degenerate thermopile’s accuracy. I want to place a TEC beneath the thermopile(back side of PCB), to stabilize the conjunction temperature. that is to say,
Is this method reasonable?
thanks