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TPS22810: Questions about 3 switches regarding technology and datasheets

Part Number: TPS22810

Dear TI,

I would like to ask a few questions about three of your switches. the switches are: TPS22810DBVT, TPS22954DQCR, TPS22965DSGT.

Regarding all 3 switches:

1. Are the switches from the same technology?

2. There is no reference in any of the datasheets(DS) to the thermal coefficient of the thermal resistance during a single pulse and pulses in different duty cycles(similar to DS of mosfets). I would appreciate any information you have on the topic as this information is very important to the design when addressing the issue of the power which develops on the component in wake-up and shutdown.

 

 

Regarding TPS22810DBVT(sot23 package) and TPS22965DSGT:

1. Is there any limit on the pace of the rising of the component's Power supply?(are you aware of a phenomenon of pulse escape when there is a too fast input voltage rise in high input voltages? What is the quickest rise time of the power supply that can be fed to the input of the component?)

 

Regarding TPS22810DBVT(sot23 package):

1. From the comparison of the thermal resistance of the component in WSON package and in SOT-23 package, I can see that the junction-to-board thermal resistance of the SOT-23 package is lower than the WSON’s. This doesn’t seem to make sense, could you explain what makes the difference?

2. What are the Imax and Ipls currents which are allowed to be used in the component? ( the DS shows that in previous versions there was such data but for some reason they were removed)

3. I would like to know what is the difference between the TPS22810DBVT component and the TPS22810-Q1? I reviewed their DS and they seem the same.

Thank you,

Eli

  • Hi Eli,

    Thanks for reaching out on E2E. Please find the answers to your questions below:

    Regarding all 3 switches:

    1: Yes, those 3 load switches use the same process technology.

    2: In general, for our load switch devices, we don't generate transient thermal response curves (transient thermal resistance vs time). What we can do is verify your specific use case to make sure they are acceptable for the device. Could you elaborate on the specific conditions you're testing in your application?

    Regarding TPS228190DBVT and TPS22965DSGT:

    1: I haven't seen any limit on the rise time of the power supply that could affect these load switches. As long as the switch is disabled as you are turning on the supply, I don't see any adverse effects on the switch.

    Regarding TPS22810DBVT:

    1: The WSON version has a thermal pad that helps to dissipate heat, allowing for a lower RthetaJB.

    2: We typically spec maximum pulse currents in the range of 300us to limit self heating of the device. What is the temperature range of the application, and what is the expected duration and occurrence of these peaks?

    3: the TPS22810-Q1 is our AEC-Q100 qualified version of the device, which is usually found in automotive applications. This version of the device has additional testing, including ESD Classifications, stress testing, and other qualifications.

    Thanks,

    Arthur Huang

    To find the latest information on Power Switches, visit www.ti.com/powerswitch