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LMZ22005: LMZ22005 - contradictory recommended reflow profiles

Part Number: LMZ22005

Hello,

We have been looking closely at the reflow soldering profile requirement for the LMZ22005 and are concerned that it could be very difficult to achieve. But we are also a little unsure about how to interpret the datasheet for the part and the referenced application note together.

 

The datasheet references the snaa214b application note (most recently dated 2016) which has reflow profile information for the NDW package used by the LMZ2* modules. I am told by our CEM that these requirements are perfectly within the usual standards and that we can meet those straightforwardly.

Here's the reflow profile info from snaa214b:

 

However, the datasheet itself (dated 2014) has a very different reflow profile with a very long total time of over seven minutes. This is not at all compatible with the sensitive components in our design such as processor and memory devices.

Here's the reflow profile from the LMZ22005 datasheet:

 

 

Which is the recommended profile for these parts? Do they really require such a long reflow process? That would make them unsuitable for a very large number of designs.

Thank you,

Jonathan