TLV759P: About thermal information

Tsukui Yusuke

Guru 21930 points

Part Number: TLV759P

Hi,

Could you tell me about the thermal information data acquisition conditions?
Please tell me the board area and PCB information when this data was obtained.
Customers want to compare their information with their own board size or PCB.

Regards,
Yusuke

over 4 years ago

0 JCHK over 4 years ago

TI__Mastermind 43630 points

Hi Yusuke-san,

The thermal data is created using a JEDEC standard High-K board. Here is an application note showing that a JEDEC Standard HIgh-K board is not an optimal layout. The reason we use the JEDEC standard is to make it easier to compare performance between devices.

I hope this helps.

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TLV759P: About thermal information