Part Number: REF3333
For REF3333AIDCK(R & T) only the physical dimensions of the SC70 are provided. The recommended pad layout is not. Is that information available? Thank you in advance for your assistance.
Regards, John Garrett TI-AFA
We do not have a drawing available of the landing pattern for the SC70-3 package. We are looking into getting that made.
However, the datasheet for the TPS715 has the suggested landing pattern for the SC70-5 package, which is the same size with different pin configuration that can be used as a reference in the mean time.
Regards, Diego Lewis
All content and materials on this site are provided "as is". TI and its respective suppliers and providers of content make no representations about the suitability of these materials for any purpose and disclaim all warranties and conditions with regard to these materials, including but not limited to all implied warranties and conditions of merchantability, fitness for a particular purpose, title and non-infringement of any third party intellectual property right. TI and its respective suppliers and providers of content make no representations about the suitability of these materials for any purpose and disclaim all warranties and conditions with respect to these materials. No license, either express or implied, by estoppel or otherwise, is granted by TI. Use of the information on this site may require a license from a third party, or a license from TI.
TI is a global semiconductor design and manufacturing company. Innovate with 100,000+ analog ICs andembedded processors, along with software, tools and the industry’s largest sales/support staff.