Hello,
In order to improve heath dissipation, I'll be grateful to know if the suggested PCB layout reported in the LM2675 datasheet, page 25, sect. 11.2, is also applicabile to the LM2675N-5.0 DIP version.
Furtherly, pins description table at page 3 reports pins 2 and 3 as "No connect pins". No problem to tie those terminals to ground also in DIP version?
Thank you in advance,
Federico