Hi, I have several questions:
1. D package for basic isolation and DWV for reinforced isolation?
2. Is the term basic isolation& reinforced isolation for both end equipment and IC? Or only for IC?
For example, Can I claim a 15kW AC/DC power module to be reinforced isolation level?
If so, the IC must provide reinforced isolation for the end equipment which is targeted to meet reinforced isolation?
3. Is the insulation specification like Viorm, Viotm for reinforced isolation IC naturally will be higher than basic isolation IC?
For example, is it possible that basic isolation IC Viotm=7000Vpk, but reinforced isolation IC Viotm=4242Vpk?
I ask this question because sometimes the customer is not sure if they need reinforced isolation IC, they will only have requirement like creepage, clearance, Viotm, etc.