This thread has been locked.
If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.
Part Number: LMG5200
I have developed a first prototype for my final master thesis using the LMG5200. I have simulated it in Tina and I dont see the ringing. I guess it is due to the layout and the EMI.
Data that is missing in my pics:
- The bootstrap cap is 0.15uF and X7R.
- The resistor and capacitors of HI and LI is 0 ohms and 10pF respectively.
- I am generating the PWM inputs with dead times through a zybo from diligent.
It is working, however I am seeing a big ringing above 1MHz. What may be the reason of this ringing? I attach you 3 pics:
- Top layer of my pcb
-Bottom layer of my pcb
- Picture of the ringing seen in the osciloscope (purple curve)
Thank you very much in advance,
Gate Driver Applications Engineering Manager
Dallas, TX USA
We are glad that we were able to resolve this issue, and will now proceed to close this thread.
If you have further questions related to this thread, you may click "Ask a related question" below. The newly created question will be automatically linked to this question.
In reply to Don Dapkus:
First of all thank you for the fast response.
The problem is that the layout considerations are thought for a multilayer PCB design, however at my university we only have the possibility to do a 2 layer design. I have done my design based on the datasheet of the LMG5200. I attach a capture of the guide I have followed.
I know that in the datasheet it is said that 2 layer PCB are not recommended due to the power loop inductance, however is the only way we have to do it.
Thats the reason all my decoupling caps are on the bottom layer.
I am also aware that the FR4 pcb is 1.57mm which is much more than the recommended 5 mils in the layout considerations, which again increases the power loop inductance.
Having those layout limitations, Is there anything else I could do to improve the ringing I see?
Thank you very much for your time and quick response again,
In reply to Carlos Salto26:
Hi, Carlos, That's a tough one... You might see some improvement by scraping off the soldermask on the top of the board and soldering some ceramic capacitors there. Based on the diagrams, I think this is possible?
I think that may be possible. I will try it tomorrow.
I was also thinking of buying a thinner pcb FR4 (I found one 3 times thinner) and implement the layout there, so the inductance reduces a 66%. Do you think that would work?
I have also changed my design to work at 2MHz instead of 3MHz, which again I think will reduce the impedance in 33%. And I am hoping that the combination of the 3 ideas will reduce significantly the power loop inductance.
Thank you very much again for the fast responce and for your time,
After the modifications done we saw around a 50% improvement, which is quite good and I think is the best we can get using 2 layers.If you have any other idea please tell me.
Thank you verymuch for your time and interest, I attach you a picture of the new waveform obtained,
All content and materials on this site are provided "as is". TI and its respective suppliers and providers of content make no representations about the suitability of these materials for any purpose and disclaim all warranties and conditions with regard to these materials, including but not limited to all implied warranties and conditions of merchantability, fitness for a particular purpose, title and non-infringement of any third party intellectual property right. TI and its respective suppliers and providers of content make no representations about the suitability of these materials for any purpose and disclaim all warranties and conditions with respect to these materials. No license, either express or implied, by estoppel or otherwise, is granted by TI. Use of the information on this site may require a license from a third party, or a license from TI.
TI is a global semiconductor design and manufacturing company. Innovate with 100,000+ analog ICs andembedded processors, along with software, tools and the industry’s largest sales/support staff.