LMG5200: heat sink question

Hello Brian,

Thanks for your inquiry. I will try to find the data for you, but for LMG5200, the junction to upper side case has relatively high thermal resistance. In this case, even if you have a heat sink on the top, it may not bring you good heat dissipation. I would recommend layout with more copper at the pad on the bottom side of device for cooling.

Thanks and regards,
Lixing

Hi Sir, 

Thanks for your reply. I will forward your recommend to my customer. It seems my customer has some limit on space of layout and placement and still need your data to update then, 

thank you.