Other Parts Discussed in Thread: UC3710
Hi:
I would like to get, if possible, more basic information for this device on its silicon die technology. More precisely, the datasheet refers to bipolar and mosfet hybrid design. Yet I do not understand if it is similar to the biCMOS technology (from sherman) of former Unitrode devices, or it is actually a different and not comparable technology ?
Regards. Jy.