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LP8550 SDBGA balling/reflowing...

Other Parts Discussed in Thread: LP8550

Hello Friends,


I was wondering if anyone had experence using LP8550 which comes in SDBGA package. I can't tell if they come with balls or do I need to ball them or do I need to just use some solder paste and reflow? Also, where do you think I can find a stencil for soldering LP 8550?


Thanks!

  • Hi Jay,

    There are balls in the DSBGA devices, you do not need to ball yourself them.

    You could search the application note "an-1112 dsbga wafer level chip scale package" from ti.com for more information.

    Thank you,

    Sami

  • Hi Sami,

    Thanks for your reply. It seems that one may not have to ball the LP8550 BUT would have to print Soldering paste on the PCB. Do you know a good source of stencil that would be good for printing soldering paste for LP8550 (5x5) DSBGA? Can I obtain it from IT?

    Below is what I see in the document you mentioned:

    Surface Mount Assembly Considerations

    DSBGA surface mount assembly operations include:

    • Printing solder paste onto a PCB.

    • Component placement using standard pick and place equipment.

    • Solder reflow and cleaning (depending on flux type). 

    Thanks,

    Jay

  • Hi Jay,

    I am sorry, but I do not have recommendation for stencil manufacturers.

    Thank you,

    Sami