LM2755 - layout rules and vias recommendations

O'Mellin

Expert 4935 points

Team,

What layout rules can be used and what types of vias are recommended for this tiny DSBGA 0.4mm pitch?

I found this :

This doesn't include all info namely the types of vias : via in pad via laser? can we fit tracks in between pads?

over 8 years ago

0 Greg Lubarsky over 8 years ago

TI__Intellectual 1940 points

Historically, I believe we have used 4mil hole in an 8 mil pad with the via slightly offset from the DSBGA pad for a 0.4mm pitch device. The via is then filled and planarized. This size hole typically is only good for going down one layer (top to mid1).

Here is a link I found on TI.com that might help further
processors.wiki.ti.com/.../BGA_PCB_design

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LM2755 - layout rules and vias recommendations