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TLC59116 heat dissipation for different package

Eng Lih Khaw
Expert 1990 points
Other Parts Discussed in Thread: TLC59116

Hi,

I have a simple question. Given same PCB, is TLC59116 with VQFN package has better heat dissipation than TSSOP package?

Thanks

  • 0
    TI__Expert 3460 points

    Hi Eng Lih Khaw,

    The VQFN package does have better head dissipation because of the thermal pad on the device. I've also included the thermal information section of the datasheet. This shows the junction-to-ambient thermal resistance which can be used to determine the expected temperature of the device junction based off the Power that is dissipated driving the LEDs.