I am designing a pcb with a TPS72715 and can't find proper landmarks anywhere for the YFF package.
I have of course read the datasheet and the description only shows the package dimensions.
What i need in perticular is:
Thanks in advance
The TPS727xx EVM for the YFF package would be a good example for how to layout this IC. Below is the attached layout PDF and gerber files.
Regarding your particular requests, this information is supposed to be attached automatically to the the end of the data sheet where is also located the package drawing dimensions. Unfortunately, this "automatic" step is not so automatic. I am looking into getting the "Land Pattern" drawing data attached but this usually takes more than a few days.
I am not sure you needed this from what you asked, but here is the format for the top marking on the package:
Topside Symbol : TPS727XXWCSP 01 +------------+ ! O YMDS ! YM = YEAR MONTH DATE CODE ! GS ! D = DAY OF LASER MARK +------------+ S = ASSEMBLY SITE CODE PER QSS 005-120 0 - PIN A1 (FILLED SOLID) LINE 2 - 3 CHARACTERS MAX
We have a general application note that discusses the YFF package land pattern recommendations. Page 8 has a good example land pattern dimensions that you can modify for a 2x2 array.
Thanks for the help, this is what I needed.
Still, I'm not sure of the size of the pads on the TPS72715 since it says between .20 and .30 mm.
The pad size on the EVM is 0.254 mm in diameter.
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