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Hi Mattias,

The TPS727xx EVM for the YFF package would be a good example for how to layout this IC. Below is the attached layout PDF and gerber files.

5315.HPA407A.GBR.ZIP

0576.HPA407A_TIS.pdf

Regards,

Darwin

Hi Mattias,

Regarding your particular requests, this information is supposed to be attached automatically to the the end of the data sheet where is also located the package drawing dimensions.  Unfortunately, this "automatic" step is not so automatic.   I am looking into getting the "Land Pattern" drawing data attached but this usually takes more than a few days.

I am not sure you needed this from what you asked, but here is the format for the top marking on the package:

Topside Symbol         : TPS727XXWCSP                                        01 
     +------------+                                                                
     ! O YMDS     !      YM = YEAR MONTH DATE CODE                                 
     !   GS       !       D = DAY OF LASER MARK                                    
     +------------+       S = ASSEMBLY SITE CODE PER QSS 005-120                   
     0 - PIN A1                                                                    
       (FILLED SOLID)     LINE 2 - 3 CHARACTERS MAX

Regards

Bill    

Hi Mattias,

We have a general application note that discusses the YFF package land pattern recommendations. Page 8 has a good example land pattern dimensions that you can modify for a 2x2 array.

0841.WCSP_PCB_Design_Application_Note.pdf

Regards,

Darwin

Hi Darwin,

Thanks for the help, this is what I needed.

Still, I'm not sure of the size of the pads on the TPS72715 since it says between .20 and .30 mm.

Regards,

Mattias