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Which low height TLV1117-33 package has best heat dissipation?

Derek
Mastermind 9701 points

Hello,

  I have an application with 12V in, 3.3V out, 300mA. Height is constrained, so I need to use either the QFN (DRJ) package or the SOT-223 (DCY) package. Which package should I use?

DRJ has better Junction-to-ambient thermal resistance but DCY has better Junction-to-board thermal resistance.

PCBA is 4 layer (signal/GND/Power/signal), 2.5" x 3.5".