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LM1086ILD-3.3/NOPB WSON Package

Frederic COTTENY
Prodigy 55 points

Hello every one,

I have a question about the pad connection on the WSON package.

Do I have to leave NC or connect to the ground?

I didn't find the pin out of the WSON package so I download the .bxl file (Thank TI).

Thanks in advance and Regards.

FC

  • 0
    TI__Mastermind 22610 points

    Yes, it appears that the WSON descriptive information was lost at the recent datasheet re-formatting.

    LM1086ILD-3.3/NOPB (WSON / NGN / 8-pins)

    The DAP (Exposed Pad) on the bottom of the WSON package functions as a thermal connection when soldered to a copper plane under the device.The DAP is connected to the die substrate with a conductive die attach adhesive. The DAP has no direct electrical (wire) connection to any of the pins. There is a parasitic PN junction between the die substrate and the device Vout. As such, it is strongly recommend that the DAP be connected directly to the Vout at device leads 6, 7, and 8 (that is, Vout). Alternately, but not recommended, the DAP may be left floating (that is, no electrical connection). The DAP must not be connected to any potential other than Vout.

    Pin 1 = GND

    Pin 2 = Vin

    Pins 3, 4, and 5 = N/C. No Internal connection. Connect these pins to GND, or leave open.

    Pins 6, 7, and 8 = Vout. The three Vout pins must all be tied together.

    Exposed Pad = Thermal connection. Connect to pins 6, 7, and 8, or leave isolated.

     

  • 0 in reply to Donald Jones
    Prodigy 55 points

    Thank you very much for your fast answer.