Other Parts Discussed in Thread: LM1117
Hello.
We are considering TLV 1117.
I have a question about the thermal resistance of the package.
Data sheet P5
TLV1117:SOT-223(DCY)θja=104.3℃/W
Also, looking at the data sheet of LM1117,
LM1117:SOT-223(DCY)θja=61.6℃/W
It is a big difference in the same package of compatible products.
Why is this?
When considering heat dissipation, it is better to use LM1117.
Thank you.