Hi,
We are using a TI LDO TPS73501DRB regulator in a new design and I have a question about the layout. (www.ti.com/.../support)
Can you confirm if the thermal pad on the DBR package is connected to GND or not. The drawing in the data sheet shows a GND, however the table does not indicate it is a GND, later in the data sheet (power dissipation) you say that the pad may be left floating or connect to GND.
Can you confirm that it is safe to connect the NC (not internally connected) pins to the thermal pad and GND as show in the sample layout. I’m assuming that it give improved soaking of heat away from the device.
Sorry for being so picky but we have seen issues with connecting thermal pads to GND in the past (that case was an op amp and we should have gone to Vee)
