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TLV757P: TLV757P DRV package Thermal Resistance

Hirotsugu Kobayashi
Mastermind 8485 points
Part Number: TLV757P
Other Parts Discussed in Thread: TLV759P, TPS737, TPS735

Hi, team.

The thermal resistance of TLV757P DRV package is 100.2 C/W, but it is larger than the thermal resistance of the same package of other LDO's.
Is this value correct?

TLV757P DRV 100.2 C/W

TLV759P DRV 80.3 C/W

TPS737 DRV 67.2 C/W

TPS735 DRV 65.1 C/W

Best Regards,

  • 0
    TI__Guru 55940 points
    Hi Hirotsugu,

    Yes the thermal information for TLV757P listed in the datasheet matches our current thermal models for the device.

    There are a variety of factors that impact the thermal performance of a device including leadframe, die size, die placement/orientation in the package, mold compound, and more. While the type of package has a large impact on thermals, due to the other factors, there can still be a large variation between two devices in the same package.

    Very Respectfully,
    Ryan
  • 0 in reply to Ryan Eslinger
    Mastermind 8485 points

    Hy, Ryan.

    I understood that the values in the data sheet are not mistakes.

    Unfortunately this business will be lost.

    Thanks,