This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

  • TI Thinks Resolved

LM2670: LM2670S-ADJ/NOPB Semiconductor Packing Methodology

Part Number: LM2670

Hi Ti,

I would like to check the tube packaging dimension and size for LM2670S-ADJ/NOPB. I found some information on the Semiconductor Packing Methodology on the below link but couldn't locate TO-263 package.

http://www.ti.com/lit/an/szza021c/szza021c.pdf

Please help to advise if you have the latest document which state this.

This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.