I am facing PCB thermal pad design issue in TPS61230DRC.
Issue is if we place via’s on thermal pad, via’s will suck all solder during re-flow soldering.
Please suggest for required changes to resolve this issue
This thread has been locked.
If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.
I am facing PCB thermal pad design issue in TPS61230DRC.
Issue is if we place via’s on thermal pad, via’s will suck all solder during re-flow soldering.
Please suggest for required changes to resolve this issue
this could happen if the vias and stencil is not good designed. it also relate to the board assemble site. please refer this application note SLOA120 and datasheet page 30 for the thermal pad vias design.
and external via outside the pad is also another solution.
thanks
Jasper
hi BHARAT
The pattern in datasheet is for reference. i would suggest customer to check with the assemble site the acceptable via size.
Thanks
Jasper Li