• State Resolved
  • Locked Locked
  • Replies 3 replies
  • Subscribers 63 subscribers
  • Views 586 views
  • Users 0 members are here
Support feedback
Options
Options
Similar topics

This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

TPS63002 IC frequent failures - thermal pad query

Sowmya Akella22
Prodigy 80 points
Other Parts Discussed in Thread: TPS63002

Hi,

We have been using the TPS63002 for fixed output voltage of 5V and have used the resistor and capacitor values as mentioned in the typical application circuit of the datasheet.

We've have faced these issues often (Unfortunately I couldn’t manage to measure the currents)

Getting an output of around 2 or 3 V instead of 5V OR No output at all at the Vout pin

After placing new ICs, these seemed to work but would fail again with same problems after a few days.

Going by the frequent failures we narrowed down the reason as a thermal one. We think not enough contact between the thermal pad of PCB and the IC was taking place due to hand soldering.

  1.  1.       What kind of thermal pad would you recommend when soldering these ICs by hand? Would you recommend a through hole thermal pad instead of the SMD one for this IC?
  2. The connections especially - EN to VIN and PS/SYNC to VIN , VIN to VINA use different resistor values in the EVM and typical application circuits. Could this be a reason for the issues? Which circuit would you recommend we follow?
  3. We are using Li-ion battery with a max voltage of 4.2 V as an input. Would you suspect not grounding the PS/SYNC but making it high (as per typical applcn circuit) causes issues for battery powered application circuits?

Thanks !

Sowmya

  • 0
    TI__Guru*** 142750 points
    Yes, the thermal pad must be soldered. There is a recommended layout for it at the end of the D/S.

    I don't think #2 or #3 relate to your issue.

    You should put a unit that fails on the EVM and see if it operates properly. This would point to a soldering issue.
  • 0
    Intellectual 265 points
    Hi Sowmya, we're seeing similar behaviour, did you manage to get a resolution?
    Thanks for sharing.
    Gal
  • 0 in reply to G M
    Prodigy 80 points

    Our issues were caused due to the IC thermal pad not contacting the thermal pad of the board. 

    If you aren't already, I suggest using hot air soldering iron for mounting the IC on the board. Also, recheck the quality of the flux you're using. 

    Though these reasons of failure might sound silly, we did have trouble for months until we found out !

    Lesson for me is to get into the details of every step. 

    Hope this helps.

    -Sowmya