Dear Sir,
We use LMR14050 in our product. Regarding the ground connection, I am confused.
In the datasheet of LMR14050, it say "The ground connection for the diode, CIN, and COUT should be as small as possible and tied to the system
ground plane in only one spot (preferably at the COUT ground point) to minimize conducted noise in the system ground plane". But LMR14050 require thermal VIAs in
the thermal Pad. And thermal VIAs will be connected to system ground plane. It is contradictory with that only one spot is connected to the system ground plane.
Please help provide some advice.
Besides, please provide the CAD file of LMR14050SEVM.
My company name is: UNICOM (GUANGZHOU) ELECTRONICS CO., LTD.
Email Address is: wells_zhu@unication.com.cn
