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thermal pad
Related Posts

  • Forum Post: Re: TPS63020 Layout

    Daniel Acevedo
    The assembly drawing in the User's Guide shows the pad under the IC; a solid rectangle. The stencil is later made by the contract manufacture to meet their process requirements which ensure that the pad is soldered to the board and doesn't short other pins. This waffle method is preferred to...
    on Dec 8, 2011

  • Forum Post: Re: Power Supply Regular - Thermal pad via filling

    JohnTucker
    The intent is for them to not be filled. In general, the via holes will wick solder out from under the area of the exposed thermal pad, decreasing the surface solder contact and hence reducing thermal performance. Keeping the via hole diameter small limits the solder wicking during the assembly process...
    on Mar 29, 2012

  • Forum Post: RE: TPS62170 / Exposed Thermal Pad

    Chris Glaser
    Probably not but it could be. Generally, the thermal pad is the substrate of the silicon which contains a material between it and the exposed pad. This material is not conductive but there may be some resulting Ohms between the die and the pad. In any case, you must solder the thermal pad to the PCB...
    on Jun 13, 2013

  • Forum Post: RE: TPS62170 / Exposed Thermal Pad

    Chris Glaser
    It should be connected to the AGND pin as well. This is the minus output voltage rail. Here is the app note for creating an inverter with these devices: http://www.ti.com/lit/an/slva469b/slva469b.pdf We plan on updating the above app note to require a schottky diode on the output, as described in...
    on Jun 13, 2013

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