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TI Home » TI E2E Community » Support Forums » Power Management » Non-Isolated DC/DC » Non-Isolated DC/DC Forum » All Tags » thermal
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thermal
  • ambient
  • free-air
  • Inverting
  • temperature
  • Theta
  • TPS40210
  • TPS54260
Related Posts
  • Forum Post: Re: TPS54610DRC thermal resistance from Junction to Board...

    Michael Day Michael Day
    Here are two links to good thermal application notes http://focus.ti.com/lit/an/slma002f/slma002g.pdf http://focus.ti.com/general/docs/litabsmultiplefilelist.tsp?literatureNumber=slma004b The thermal information you are looking for is not available in all our datasheets. You can contact your...
    on Dec 9, 2010
  • Forum Post: Re: TPS43000 thermal spec

    Angela Angela
    Chris, The two links on that post are bad links. Can you send me the info? Thanks, Angela
    on May 18, 2011
  • Forum Post: Free-air vs. Ambient Temperature

    Chris Glaser Chris Glaser
    What is the difference between operating free-air temperature and operating ambient temperature? Both use Ta.
    on Jan 17, 2012
  • Forum Post: Thermal/Airflow question

    Titusc Titusc
    Hi there, I am new to thermal. I want to ensure my SUT will still operate with a fixed temperature without airflow. I placed my SUT in the temperature chamber. What can you say about the airflow? The fan turns on and off constantly to regulate the temperature. Any input? Thanks, TC
    on Apr 11, 2012
  • Forum Post: RE: TPS54260 -12V output,

    Anthony Fagnani Anthony Fagnani
    Hi Cindy, I want to be sure, did you use Equation 5 to estimate the maximum output current? 2A seems high. If your PCB design is the same as (3) test board conditions, the Θjaeffective will be approximately Θja given in the second row of the Thermal Information table on the TPS54260 data...
    on Jun 28, 2012
  • Forum Post: RE: Reducing TPS40210 Temperature

    Anthony Fagnani Anthony Fagnani
    Hi Andrew, The majority of the losses in the IC are gate drive losses. Two recommendations to reduce the temperature are below. Make sure the thermal pad is soldered down properly with the recommended footprint and vias given in the datasheet. Also use as much PCB area as possible and connect this...
    on Mar 13, 2013
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