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Q: TPS62110 - Ground Connections by 741196
Could you help with the question below?
Do we really separate the GNDs with the TPS62110 reference design?
Does gnd separation really needed?
I have question about tps62110 layout – in datasheet written that Epad should be connected to AGND but in slvu135 it’s connected to PGND.
Could you clarify?
A: Re: tps62110 by 1090425
All grounds should tie together in one place. The easiest and recommended place to do this is under the IC at the thermal pad. When routing the separate grounds, be sure to keep them separate until they tie together at the thermal pad. If the routing is done this way, it is irrelevant which ground the thermal pad is tied to, as both grounds connect at the thermal pad.
Q: Re: tps62110 by 10449
Additional information from another post
First, please note that the TPS62110 does not have a PowerPad. This exposed copper under the IC is technically called an Exposed Thermal Pad. The package appendix at the end of the datasheet governs the use of the Exposed Thermal Pad. Per the appendix drawing, the Exposed Thermal Pad MUST be soldered to the PWB for mechanical reliability. Although the Exposed Thermal Pad can be connected to a floating PWB trace, TI recommends that it be connected to the ground plane for better thermal relief becaue of the larger PWB copper area.
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