Q: TPS65070 Thermal Pad Discrepancy on Datasheet by 1338456

Hello,

I noticed a discrepancy on the TPS65070 datasheet regarding the orientation of the thermal pad on the IC. On page 87 of the datasheet, the thermal pad is centered. However, on pages 88 and 89, the thermal pad is not centered. Upon further inspection it seems that the dimension markers on the centered version are misaligned, causing me to believe that the information on pages 88 and 89 is correct.

Can you please confirm?

Many thanks,
Ian Williams


A: Re: TPS65070 Thermal Pad Discrepancy on Datasheet by 1169162

Hello Ian,

 

the mechanical drawing on page 87 of the TPS65070 dtahsheet does not provide any information on the exposed thermal pad dimensions.

It is correct thta the exposed thermal pad is not centered. For information od exposed thermal pad dimesnions please have a look at page 88 fo teh datasheet.

An example Board layout and stencil design is given on page 89 of the TPS65070 datasheet.

Please have a look at the following forum post.

http://e2e.ti.com/support/power_management/pmu/f/200/p/34757/127742.aspx#127742

 

Kind Regards,

 

Christian