• Resolved

LM20134MH/NOPB in the 16-TSSOP package

I have a quick question about the footprint for TI's LM20134MH/NOPB in the 16-TSSOP package. The datasheet specifies all the information needed to create the footprint except for the thermal pad dimensions. The drawing is PWP (R-PDSO-G16) and it states that the information for the thermal pad can be found elsewhere in the datasheet, however I was unable to locate the dimensions. I was unable to find anything concerning this on TI's website so I'm really hoping you'll be able to help me locate this information. Thank you very much and I look forward to your reply.