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LM20134MH/NOPB in the 16-TSSOP package
I have a quick question about the footprint for TI's LM20134MH/NOPB in the 16-TSSOP package. The datasheet specifies all the information needed to create the footprint except for the thermal pad dimensions. The drawing is PWP (R-PDSO-G16) and it states that the information for the thermal pad can be found elsewhere in the datasheet, however I was unable to locate the dimensions. I was unable to find anything concerning this on TI's website so I'm really hoping you'll be able to help me locate this information. Thank you very much and I look forward to your reply.
Attached is the land pattern for the LM20134. Many of the SVA documents have not yet been updated on the website, eventually, all will be accessable from the Product Folder page.
And just curious what this is being designed in to, and the customer. You can contact me directly so as not to post any sensitive information on this page.
Thanks much... Happy Holiday :-)
You're welcome . .. and on second thought, I think this document would be directly for this R-PDSO-G16 package: http://www.ti.com/general/docs/lit/getliterature.tsp?literatureNumber=PPTD024Y&fileType=pdf .
Hi Lenard & Rinzai --
Same question for LM3668 http://www.ti.com/lit/ds/symlink/lm3668.pdf -- I'd like to get the thermal pad dimensions.
Thanks very much!
Here you go, Joe. Thermal pad and Land Pattern for the PWSON-N12 package of the LM3668.
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