CSD17313Q2: About Continuous avalanche energy of CSD17313Q2 Question.

Part Number: CSD17313Q2

Dear support member,

My customer is producing board at CSD17313Q2.


Is there a provision for continuous avalanche energy of CSD17313Q2?
Or is there something like internal data?

Urgent wait for reply.

Best regard.
Bob Lee.

5 Replies

  • Bob, 

    UIS and avalanche ratings are provided on the front page of the datasheet. If you are asking for repetitive avalanche rating this is not something we provide. 

    In general, we do not recommend putting the FET into avalanche in the application as if this is reoccurring, we cannot make any predictions about the long term reliability of the device. In general, the destruction that comes from reoccurring avalanche events (even very small energy ones) is is not very well understood for FETs. Our competitors who make claims of guaranteed repetitive avalanche on their datasheets just do so but strongly derating their single pulse capability. 


    Brett Barr

    Product Marketing Engineer, Mid-Voltage FET

    b-barr@ti.com

    (610) 849 5114

  • In reply to Brett Barr1:

    Dear Brett Barr1,

    Thank you very much quick response.


    Best regard.
    Bob Lee.

  • In reply to Bob Lee62837:

    Dear Brett Barr,

    May I have add a question?

    1.Is there a definition of single pulse time for avalanche energy?

    2.Is there a definition of the package limit time of Continous Drain Current?
    Is it a problem even if it is less than 100 μs?

    Best regard.
    Bob Lee.

  • In reply to Bob Lee62837:

    Bob, 

    The amount of energy a part can absorb in avalanche (or current for that matter) varies as a function of how long the duration will last. 

    The longer the duration, the less current / energy can be dissipated into the FET. 

    The curve that shows this relationship between current and avalanche pulse duration is provided in Figure 11 of the datasheet. 

    There is no limit on the duration for the package limit current of a device so long as the junction temperature stays below the abs max, or preferable 125deg. However, eventually running at the package limit without providing a means for the part to get the dissipate heat will cause the part to overheat. How quickly this happens depends on the thermal impedance and capacitance of your board and thermal environment. 

    Brett Barr

    Product Marketing Engineer, Mid-Voltage FET

    b-barr@ti.com

    (610) 849 5114

  • In reply to Brett Barr1:

    Dear Brett Barr,


    Thank you very much for reply.

    Best regard.
    Bob Lee.