This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

  • TI Thinks Resolved

CSD85302L: Reflow Soldering Issue

Part Number: CSD85302L

Can anyone Help,

I cannot prevent solder balls forming and solder migrating from the pads of 1 and 3 of this device during reflow.

I am seeing solder pulling away from these pads but staying connected to the pads.

I am using a 3 thou stencil with aputrues cut as per the recomendation in the data sheet and am using type 4 lead free solder paste. 

Please help

Kind regards

Darren

  • In reply to Darren Morris:

    Darren,
    I am not sure that a full simulation is something we can support at this time. I apologize.

    Again we need to emphasize that if the datasheet dimensions are not followed, the most likely issue you would encounter is package tilting but not the balling that you encountered which is driven by reflow optimization.

    Best Regards!

    Brett Barr

    Product Marketing Engineer

  • In reply to Brett Barr1:

    Hi Brett,
    Many thanks for all your help and advice with this issue.
    I am note due to assemble this product again for another month so are unable to assess if altering the reflow profile will eliminated this issue.
    If possible I would like to keep this issue open until I have assembled the next batch and are able to confirm if altering the reflow profile has eliminated this issue.

    Kind regards
    Darren
  • In reply to Darren Morris:

    Darren,
    No problem. Please feel free to come back once you attempt the new reflow profile. As a policy, we are supposed to "close" threads when there may not be any traffic on them for some time, and for the time being I am going to consider your issue resolved. I know you probably get some notification asking you to confirm - you can just ignore that message for now.

    But you still have 60 days to reopen the thread if there proceeds to be an issue. Or if you come back in three months and the thread is closed permanently, you can either start a new thread and link to this one (I'll still be the one answering) or better yet, send me a friend request on E2E, we can exchange emails, and work the issue offline.

    Best Regards!

    Brett Barr

    Product Marketing Engineer

This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.