Query on TO220 MOSFET assembly using a clip

Anoop Abraham

Prodigy 110 points

Other Parts Discussed in Thread: CSD19536KCS

Hi,

We are using CSD19536KCS MOSFET from TI in our motor control project.

It is a TO220 power MOSFET and we are using a clip to assemble it on to the heat spreader / heat sink.

Is there a TI recommended method for mounting the MOSFET using a clip ?
Where exactly should the pressure be applied on the MOSFET body against the heat spreader / heat sink to ensure maximum heat transfer ?

We would like to verify our existing clip assembly w.r.t. the recommendations.

Our final goal is to achieve maximum heat transfer from MOSFET to heat spreader / heat sink.

Looking forward to know expert opinion regarding the matter.

Thanks,

Anoop

0821 2409231

over 8 years ago

0 Brett Barr1 over 8 years ago

TI__Mastermind 18200 points

Anoop,

TO-220 packages are typically mounted on a heat sinking using a clip in a manner shown in the attached image.

Clips are usually available for soft clamping (~20N of pressure) or hard clamping (~200N of pressure). Exceeding 200N can cause damage to the device and can cause failure.

Pressure should be applied with the clip to the center of the package.

0 Anoop Abraham over 8 years ago in reply to Brett Barr1

Prodigy 110 points

Hello Brett,

Thanks for your prompt reply.

I am using TO220 package. If you see the body of TO220, there are two portions that is TAB (Metal part) & plastic (black area).

When you say center of the package, is it including TAB & Plastic area or only the plastic area ?

Thanks,

Anoop

0 Brett Barr1 over 8 years ago in reply to Anoop Abraham

TI__Mastermind 18200 points

Center of the plastic area.

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Query on TO220 MOSFET assembly using a clip