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What is the thermal resistance of the CSD18540Q5B from the die to top of package

Mark Dahlman
Intellectual 1985 points
Other Parts Discussed in Thread: CSD18540Q5B

I have a customer that would like to put a heat sink on the top of a CSD18540Q5B.  The junction to case is listed in the datasheet, however this number doesn't represent the thermal resistance from the die to the top of the package.  Is this information available

  • 0
    TI__Mastermind 18200 points

    Mark, 

    This value is dependent on a lot of factors - how much power you are dissipating through the part, size of the board the part is on. To get a true junction to top thermal value, you would need to isolate the bottom case completely, which is near impossible. 

    In most practical applications, we see it to be around 15-20deg C/W.