Hello,
Having some behavioral issues with boards we just got back containing femtofets, specifically CSD17484F4T, and am wondering whether you can offer any recommendations for placement?
1.) Am I correct that these parts are ROHS compliant, and that the outermost stackup layer is Au? In the "Packaging Information" portion of the datasheet there is a footnote (6) which says to call regarding the lead/Ball finish. Is it safe to assume that if we ordered CSD17484F4T, that we are working with the Au finish, and not the lead finish?
2.) Is there a recommended solder/flux?
3.) What are the reflow/assembly temperatures for this part during assembly?
4.) What is the recommended cleaning procedure for this part if there is one?
5.) Do your answers apply to the rest of the femtofet family?
Best Regards,
Mark