Part Number: CSD85302L
Can anyone Help,
I cannot prevent solder balls forming and solder migrating from the pads of 1 and 3 of this device during reflow.
I am seeing solder pulling away from these pads but staying connected to the pads.
I am using a 3 thou stencil with aputrues cut as per the recomendation in the data sheet and am using type 4 lead free solder paste.
Product Marketing Engineer, Mid-Voltage FET
In reply to Brett Barr1:
Thank you for kindly sparing the time to respond to my post.
I am using a 0.0762mm (3 thou) stencil thickness.
The component is being mounted aoutomaticly using Samsung SM482 placement machines.
I made sure that the component is just being placed on to the paste rather then being pushed into the paste and have verifiyed the paste displacement by x-ray before reflow. their is virtually no paste displacement before reflow.
I am at a loss as to what is caursing this issue.
I have attched an image of the stencil apertures we are using against the mask defined coper lands, if you have any comments on this I would be grateful for any help and suggestions
In reply to Darren Morris:
I do not seem to be able to insert a file or an image of my reflow profile.
We are using 8 zone convection oven
The profile is as follows:
26c to 150c 79 seconds
150c to 200c 118 seconds
200c to 217c 15 seconds
Above 217c for 68 seconds
Max temp 246c
DO you have an comments regarding the stencil image in my prevouse reply?
8490501 Reflow Profile.pdf
Our packaging engineer recommends you try following this. I will follow up on the stencil comments.
I am not able to follow the reflow profile you have kindly provided as it does not show enough detial.
Would it please be possible to provide more detial in particular time zones between the tempertures below.
Regarding our stencil aperture size for the 2 larger lands of this device we have not followed the data sheet recomendations and have made these apertures smaller than recommended.
Would it please be possible for your packaing engineer to provide his view on the possiblity of this caursing an issue, is it possible that these 2 lands are pulling the device closer to the PCB as the solder on these 2 lands has more room to spread during reflow where as the smaller 2 lands do not have any wehre for the solder to go?
I have attached a file that detials the dimentions of the land, solder mask openings and stencil stencil apertures we have used.
Would it be possible to provide me with the dimentions of the lands, solder mask openings and stencil apertures you have used.
Q1 Copper Resist & Stencil.xlsx
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