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CSD85302L: Reflow Soldering Issue

Part Number: CSD85302L

Can anyone Help,

I cannot prevent solder balls forming and solder migrating from the pads of 1 and 3 of this device during reflow.

I am seeing solder pulling away from these pads but staying connected to the pads.

I am using a 3 thou stencil with aputrues cut as per the recomendation in the data sheet and am using type 4 lead free solder paste. 

Please help

Kind regards