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BQ500101: Soldermask design for DPC Package (BQ500101

Part Number: BQ500101

There is no entry for the DPC package in the TI footprint library.

The datasheet for BQ500101 only declares the pastemask but does not define the soldermask.

The package is not covered by standard technology (expansion 50µm, minimum sliver 100µm).

Could you please give a recommendation for the preferred soldermask?

Thank you!