Other Parts Discussed in Thread: CSD95492QVM
Hi TI expert,
We met a problem in using CSD95372BQ5M. The Junction to case thermal resistance(Top of package) is 15deg.C/W. In our system, the thermal couple is used to measure the Top case temperature. If using 15 deg.C/W*Pd 2W, the junction temperature would be 30deg.C higher than Top case. And then it is over our derated spec.
Could you advise the Junction-to-TOP characterization parameter of this part? I've read a paper from TI website. In the paper, it mentioned that only a very small percentage of heat energy in a typical plastic package is convected and radiated off the top surface of the package. And the actual junction temperature can be very closely estimated by junction-to-top characterization parameter. http://www.ti.com/lit/an/spra953c/spra953c.pdf
There is same question on CSD95492QVM.
Look forward to your feedback.
Thanks,
Dora