Hi All,
Due to space problem we have placed the subjected device on bottom of the PCB, while soldering(Re-flow Oven) the device drops and need to hand solder.
Can anyone suggest the solution? We don't want to used through hole device due to complexity of the PCB.
Regards,
.
Manish:
There are no power modules which can be reflowed on the mother bottom side .
They will either fall off during the reflow process or they will have to be reflowed facing upward , located atop the host board during the final reflow process.
Tom