Hello,
I am using these two chips in a new design. We recently got our boards back after assembly and noticed that somehow a solder mask void was not placed under pin 1 on each chip. So pin 1 on each chip was essentially floating. Our technician was able to scrap away the solder mask next to pin 1 and connect pin 1 to the copper pour next to the chip. What i am wondering is whether it is worth it to send the boards back to have the solder mask under pin 1 removed to get a better connection. Is it essential to have the entire pin 1 pad soldered to the copper underneath or is just connecting the side of the pad okay? Could you comment on an performance issues i might run into if we do not send the board out to get repaired?
Thanks,
Brandon
