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PTB48560AAS vs. PTB48560AAZ

Hello, 

Currently we are using TI’s PTB48560AAS, and our manufacturing partner requesting us to approve PTB48560AAZ also as a second source.

However, understand from datasheet that, the 2 parts have difference in Peak reflow temperature.

Could you please review and advise, can the PTB48560AAZ work at the Peak Reflow temperature of 235C? Also, these 2 parts can be interchangeable?

Thanks,

Sudhakar

  • Sudhakar:        

    PTB48560AAS  (S) PTB48560XAS (S) , (S) denotes tin(Sn)/lead(PB) solder ball I on each power pin. It is recommended to be reflowed with tin/lead solder paste in the final reflow assembly process for reliable solder connection process. . Maximum tin(Sn)/lead(Pb) reflow component / solder temperature is recommended not to exceed 235°C. It must not be reflowed with lead free(SAC) solder paste.

    PTB48560XAZ(Z) PTB48560AAZ (Z) denote Lead free(SAC)(tin(Sn), Silver(Ag) , Copper(Cu) solder ball on each power pin. It is recommended to be reflowed with (SAC) solder paste in the final reflow assembly process for reliable solder connection process. Minimum reflow component temperature of (Z) versions is minimum ≥235°C component/pin temperature for 20 seconds to maximum ≤260°C must only be reflowed with lead free(SAC) solder paste

    The (Z) version High temperature reflow application  note is attached.

    Tom
    If there  are any other questions on this data, my direct e-mail is tguerin@ti.com

    slta054aHigh Temp Z versionslead free process. pdf.pdf