hi
there are two GNDs: AGND and PWRGND as per recommendations both have to be connected to each other through pins no 8, 9 GND_PT. out of these two GNDs which has to be connected to main PCB GND
1) out of these two GNDs which has to be connected to main PCB GND ?
2) PWRGND is the GND where ground bounces may happen , should the area of that be minimised? and connected to AGND through pins 8,9. then AGND is connected to main PCB GND??
3) as per datasheet page no 22 layout guidelines instructions point no 4 it says pour AGND beneath the IC. but recommended layout shows poured PWRGND.??
should AGND and PWRGND be separated in top layer only??