TPS82130: difference of the internal structure between NanoStar(WCSP) and PicoStar

user4699602

Intellectual 570 points

Part Number: TPS82130

I'd like to ask you about difference of the internal structure between NanoStar(WCSP) and PicoStar.

Please tell me the details where noted in red circle in the picture.

If you have it, could you send to me documents of the internal structure ??

over 6 years ago

0 Chris Glaser over 6 years ago

TI__Guru*** 142880 points

PicoStar is a very thin die used for embedding. As shown in the picture, the solder bumps are not directly attached to the die, as in WCSP.

As well, the TPS82130 does not use solder bumps, but uses a QFN style land pattern.

0 user4699602 over 6 years ago in reply to Chris Glaser

Intellectual 570 points

Thank you for your response.

I might be saying the same thing again, Please tell me the internal structure PicoStar

The PicoStar shows that the solder bumps are directly attached to the die.

0 Chris Glaser over 6 years ago in reply to user4699602

TI__Guru*** 142880 points

I'm not sure that I understand your question. The 2 drawings you show are of different things. The top drawing shows a WCSP package bump, while the bottom drawing shows a MicroSiP module with an embedded PicoStar die.

PicoStar has no solder bumps but allows a direct copper to copper connection inside a module (embedded).

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TPS82130: difference of the internal structure between NanoStar(WCSP) and PicoStar